GE Appliances has announced plans to significantly expand its use of U.S.-manufactured semiconductors by partnering with Texas Instruments (TI) to supply chips for its next generation of connected laundry appliances.
Beginning in 2027, TI microcontrollers, Wi-Fi connectivity solutions and analog components produced at the company’s manufacturing facilities in Texas and Utah will be integrated into products manufactured at GE Appliances’ new laundry plant in Louisville, Kentucky.
The move will see TI supply around one-third of the semiconductors used in production at the facility, while nearly doubling GE Appliances’ spending with the semiconductor manufacturer. The agreement forms part of GE Appliances’ wider strategy to strengthen its domestic supply chain and increase sourcing from U.S.-based suppliers.
The appliance manufacturer said the partnership supports its “Zero Distance” strategy, which aims to locate suppliers closer to its manufacturing operations and customers. The company currently works with around 6,500 U.S.-based suppliers.
Lee Lagomarcino, vice president of Clothes Care at GE Appliances, said the expanded relationship would provide access to a broader portfolio of domestically manufactured semiconductors while accelerating product development.
TI’s broad portfolio of advanced embedded processing and analog technology will help our engineers design appliances that are smarter, more powerful and more efficient than ever before,” he said. “Moving forward, our domestic research and development teams can also save significant time on new solutions for U.S. consumers.
Lee Lagomarcino, vice president of Clothes Care at GE Appliances
The collaboration also reflects the growing emphasis on supply chain resilience across North American manufacturing, particularly for critical electronic components. TI manufactures embedded processing and analog semiconductors at facilities in Richardson and Sherman, Texas, as well as Lehi, Utah, making it one of a limited number of companies offering high-volume semiconductor manufacturing in the U.S.
The semiconductors will enable a range of new capabilities in GE Appliances’ connected laundry products, including enhanced wireless connectivity through integrated Wi-Fi and Bluetooth Low Energy technology, improved energy efficiency through advanced power conversion, and quieter operation using gallium nitride (GaN)-based motor drive technology.
According to GE Appliances, the new electronics platform will also improve appliance reliability, serviceability and power management while supporting future product architectures.
Looking ahead, the companies are exploring the use of TI’s intelligent microcontroller platform to support AI-enabled appliance functionality. The architecture incorporates an integrated neural processing unit designed to enable features such as predictive maintenance, adaptive performance algorithms and more precise load control while maintaining low-power operation.
Vinay Agarwal, vice president and general manager of MSP Microcontrollers at Texas Instruments, said the partnership demonstrates how domestically manufactured semiconductors can support the next generation of smart appliances.
“We’re proud to support GE Appliances as they expand their U.S. manufacturing supply chain,” he said. “By bringing together next-generation Wi-Fi connectivity, energy-efficient microcontrollers, edge AI capabilities and breakthrough GaN-based motor drive technology, TI is giving GE Appliances the building blocks to design smarter, more efficient and more connected appliances.”
GE Appliances said TI will have further opportunities to bid for additional semiconductor supply contracts as the company continues investing in U.S. manufacturing and developing new connected products.
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